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IC tag IC chip strength enhancement processing

We have developed a new technology that further improves the pressure resistance and impact resistance of IC tags.

The major weaknesses of IC tags in terms of shock resistance and pressure resistance are the relatively low strength of the semiconductor material that makes up the IC chip and the poor contact at the connection point between the IC chip and the antenna. Although traditional PVC molding has improved strength due to the cushioning properties of PVC, new technology has made it difficult for the IC chip to be directly affected by external shocks or pressure. While previous methods alleviated external pressure, the new technology is designed so that pressure is not applied directly in the first place, achieving even higher shock and pressure resistance. Additionally, this technology can be applied not only to PVC molds but also to standard IC label formats. At first glance, it may appear to be a typical IC label, but the new internal structure significantly enhances its strength. *Note: This processing will not be effective if the tagged object itself experiences vibrations or shocks.

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